[BOND] Changes for rev3
@sistemicorp is already working on this.
Since Oct 15, 2025.
Assessment
This issue has not been assessed yet.
Description
HW Changes that need SW support,
- Battery Emulator DAC moves from HDR 1 to IOX
- Have Battery Emulator calibration move to the
setup()call on boot up now that IOX is used. - Free up HDR1 port6 to the user now that its not used for Battery Emulator
- reduce tolerance for 6V check, its set to 150mV because rev1 had 5.9V. Use 100mV.
- SMPS ENable moved from D13 to D10 because D13 is shared with onboard LED.
- USB-PD was added, so now CYPD3176 can be quiried over I2C from Teensy. (see P1150 code)
- VDUT_EN moved from D41 to D11 to get another analog input pin to measure VNEG2V5
- Add VNEG2V5 measurement
- VDUTSMPS_INT changes from D40 to D12 in order to free up another Teensy analog input, which is not used at the moment.
- BOM change R82 -> 68K
- BOM change R72/74/86 -> 200K
- BOM change INA220 -> INA226
- Add DIODE on VSYS SMPS input
- STLINK-V3MODS add UART connection
- Over current protection done in hardware for various supplied (VDUT, ...)
- NRF JTAG Header (10 pin) in parallel with the big JTAG ribbon cable?? Or keep using the Segger cable converter
- 5th header that uses all MAX11311 ports, so another +12 test points
- Need to change the type of header because there is too much friction, too hard to separate Pogo and BOND.
- ...
- Dominant language
- C++
- Stars
- 4
- Forks
- 0
- PR merge metrics
- No merged PRs in 30d
Getting set up
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First steps
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- Open a pull request that references the issue number.
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Add P1150 Hardware DriverMay be free again @sistemicorp claimed this 188 days ago, and no pull request is open. Openenhancement
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